<?xml version="1.0" encoding="UTF-8"?><ns2:project xmlns:ns1="http://gtr.rcuk.ac.uk/gtr/api" xmlns:ns2="http://gtr.rcuk.ac.uk/gtr/api/project" xmlns:ns3="http://gtr.rcuk.ac.uk/gtr/api/fund" xmlns:ns4="http://gtr.rcuk.ac.uk/gtr/api/person" xmlns:ns5="http://gtr.rcuk.ac.uk/gtr/api/project/outcome" xmlns:ns6="http://gtr.rcuk.ac.uk/gtr/api/organisation" ns1:created="2026-07-08T08:44:08Z" ns1:href="http://gtr.ukri.org/gtr/api/projects/07629D0A-2E25-499A-B3D9-DA36A78D697A" ns1:id="07629D0A-2E25-499A-B3D9-DA36A78D697A"><ns1:links><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/persons/65DDC75C-9FEA-4930-8896-D83E9BFC529B" ns1:rel="PM_PER"/><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/organisations/3EBAE129-0223-48DB-B3E4-D38E5DDD5B77" ns1:rel="LEAD_ORG"/><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/organisations/3EBAE129-0223-48DB-B3E4-D38E5DDD5B77" ns1:rel="PARTICIPANT_ORG"/><ns1:link ns1:end="2014-09-29T23:00:00Z" ns1:href="http://gtr.ukri.org/gtr/api/funds/DBDD1025-9818-48FD-80FA-31F4B7A4394A" ns1:rel="FUND" ns1:start="2013-01-01T00:00:00Z"/></ns1:links><ns2:identifiers><ns2:identifier ns2:type="RCUK">720151</ns2:identifier></ns2:identifiers><ns2:title>Brazed Diamond Band Saw Development (Revised)</ns2:title><ns2:status>Closed</ns2:status><ns2:grantCategory>GRD Development of Prototype</ns2:grantCategory><ns2:leadFunder>Innovate UK</ns2:leadFunder><ns2:abstractText>C4 Carbides currently manufactures and sells three product ranges: synthetic diamond-coated
&amp;amp; tungsten carbide-coated power drill accessories and tungsten carbide saw blades. These are
sold to some of the world’s leading brands including Bosch, Black and Decker, AEG and
Hitachi. We have developed a novel method for diamond coating. This project aims to
combine our diamond-coating process, the continuous strip line process and a patented
reduced kerf design to develop a range of diamond band-saw blades. There are technical
challenges involved in making the blades because the diamonds must be bonded to the steel in
a way that maximises the cutting and abrasion performance whilst retaining (or even
improving) the flexibility and fatigue resistance of the backing material. Normally, diamond
grit is either sintered (embedded in a powder and heated) or electroplated onto the substrate.
The C4 process involves coating the diamond grit with a special ceramic layer, and then
brazing the coated diamonds onto the substrate without using a vacuum. The ceramic layer is
capable of forming a bond with the metal carrier during the brazing process. This innovation
has led to performance improvements and lower costs and the C4 diamond-coated product
range has generated significant new sales, principally in rigid hole saw blades and drills.
The band saw blades will be optimised for particular applications and tested with potential
customers. We will address two distinct market segments, each of which has particular
technical requirements. A proof of market study has previously identified that the cutting of
graphite is the largest and most technically achievable application. Of the other potential
applications we currently target the silicon wafer slicing market that we believe has high value
and massive growth potential driven by demand from manufacturers of semiconductors and
photovoltaic panels.</ns2:abstractText></ns2:project>