10121133PhotUnion: Cost-efficient and Scalable Heterogeneous Integration of Photodiodes on Transimpedance AmplifiersActiveCR&D BilateralInnovate UKThe goal of this project -- **PhotUnion -** is to leverage microtransfer printing technology (uTP) to develop a cost-efficient, scalable, heterogenous, wafer-level direct assembly process for photodiodes (PD) on top of transimpedance amplifiers (TIA) that surpasses current state-of-the-art performance at a reduced cost. In particular, the end product will comprise an optimized 10G III-V photodiodes produced by Albis Optoelectronics (Albis) and microtransfer printed by CSEM at the wafer level onto a 10G Super TIA wafer from HiLight Semiconductor (HiLight). This final product offers a cost-effective, high-sensitivity alternative to existing avalanche photodiode (APD) based solutions, enabling low electromagnetic interference (EMI) operation in fiber-to-the-home (FTTH) applications, specifically addressing the 10G-PON market worldwide. The direct, and close union of photodiode on TIA opens up a wide range of cost-effective and high-performance combinations for various applications, including 25G and 50G PON for future FTTH, as well as 800G, 1.6T and 3.2T datacom for AI.