<?xml version="1.0" encoding="UTF-8"?><ns2:project xmlns:ns1="http://gtr.rcuk.ac.uk/gtr/api" xmlns:ns2="http://gtr.rcuk.ac.uk/gtr/api/project" xmlns:ns3="http://gtr.rcuk.ac.uk/gtr/api/fund" xmlns:ns4="http://gtr.rcuk.ac.uk/gtr/api/person" xmlns:ns5="http://gtr.rcuk.ac.uk/gtr/api/project/outcome" xmlns:ns6="http://gtr.rcuk.ac.uk/gtr/api/organisation" ns1:created="2026-06-22T07:57:45Z" ns1:href="http://gtr.ukri.org/gtr/api/projects/1FE7E54D-0D7A-4D5E-84C0-35CCC4C245F5" ns1:id="1FE7E54D-0D7A-4D5E-84C0-35CCC4C245F5"><ns1:links><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/persons/D4A75786-5117-4B0E-BB69-5A12940C4D51" ns1:rel="PM_PER"/><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/organisations/FBAA0DD3-4241-474F-BE22-A56FCE34F57B" ns1:rel="LEAD_ORG"/><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/organisations/8E38A887-3CD8-49FD-87E5-A1844E81B9CF" ns1:rel="PARTICIPANT_ORG"/><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/organisations/2AE6B36F-0001-46DD-8E77-82B893806B8B" ns1:rel="PARTICIPANT_ORG"/><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/organisations/FBAA0DD3-4241-474F-BE22-A56FCE34F57B" ns1:rel="PARTICIPANT_ORG"/><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/organisations/2EC6F9D4-1EB7-4E1F-8BB2-2DD67FAFB685" ns1:rel="PARTICIPANT_ORG"/><ns1:link ns1:end="2016-09-29T23:00:00Z" ns1:href="http://gtr.ukri.org/gtr/api/funds/CD8301A9-E28B-4D0C-8E51-FF8988753F18" ns1:rel="FUND" ns1:start="2015-03-31T23:00:00Z"/></ns1:links><ns2:identifiers><ns2:identifier ns2:type="RCUK">102154</ns2:identifier></ns2:identifiers><ns2:title>haRFest</ns2:title><ns2:status>Closed</ns2:status><ns2:grantCategory>Collaborative R&amp;D</ns2:grantCategory><ns2:leadFunder>Innovate UK</ns2:leadFunder><ns2:abstractText>This project addresses the use of printed electronics (PE) manufacturing to produce battery-free RF-powered systems, exploiting existing and widespread Near Field Communication (NFC) infrastructure. The project will develop processes to optimise the RF system performance, including antenna-tuning, and exploit PE processes (printed conductive circuity, low-cost integration) scalable to low-cost, high-volume applications in consumer packaging, document and brand security, in addition to wireless sensor networks for defence, healthcare and medical devices. The project will advance the state-of-the-art by developing technologies for high volume manufacturing of self-tuned energy-harvesting power units (modules), which fits the requirements of flexible, disposable and wearable applications. The project brings together a strong consortium with varied and complementary expertise in printing of conductive structures (WCPC, CPIIS), logic circuitry (PragmatIC), test (PragmatIC, CPIIS, CU) and integration (PragmatIC, CPIIS).</ns2:abstractText></ns2:project>