131742Low stress large die attach for high temperature use, using liquid solder and TLP/SLID techniquesClosedFeasibility StudiesInnovate UKThe project 'Low stress large die attach for high temperature use, using liquid solder and TLP/SLID techniques' will investigate the feasibility of combining liquid solder and transient liquid phase techniques to produce structured solder joints capable of operating over extended temperature ranges. By controlling the structure and materials used, an operating range of in excess of +300C to -75C should be obtainable.