70192Variable Topology Semi-Rigid Packaging (V-Top)ClosedFeasibility StudiesInnovate UKVariable Topology Semi-Rigid Packaging is a new and innovative packaging system using multi-material 3D printing technology that may be used in a production environment to create customisable packaging, on demand. The application of surface tessellation to shrinkable films using fused deposition modelling (3D Printing) will result in the film topology automatically changing during shrinkage to create food or drink packaging. The benefits of such a process include a significant reduction in costs and resources employed in the manufacture, delivery and storage of pre-formed packaging products plus substantially reduced wastage associated with the packaging of seasonal or short shelf-life products (i.e. elimination of 'out-of-date packaging). The concept is founded on water sensitive composites developed at MIT. The technology has been termed 4D printing as it incorporates the element of time. MIT's moisture sensitive material can be 'programmed' to fold and unfold in the presence of humidity. MIT have created 'multi-material prints with the capability to transform from one shape to another'. This technology uses heat sensitive materials rather than moisture sensitive materials. The objective of the project is to establish that this innovation is technically and commercially viable and that it will address the issues associated with current packaging and processing systems.