<?xml version="1.0" encoding="UTF-8"?><ns2:project xmlns:ns1="http://gtr.rcuk.ac.uk/gtr/api" xmlns:ns2="http://gtr.rcuk.ac.uk/gtr/api/project" xmlns:ns3="http://gtr.rcuk.ac.uk/gtr/api/fund" xmlns:ns4="http://gtr.rcuk.ac.uk/gtr/api/person" xmlns:ns5="http://gtr.rcuk.ac.uk/gtr/api/project/outcome" xmlns:ns6="http://gtr.rcuk.ac.uk/gtr/api/organisation" ns1:created="2026-06-03T15:52:43Z" ns1:href="http://gtr.ukri.org/gtr/api/projects/58FC96B2-F447-4B63-B83D-92C3E37CEBF7" ns1:id="58FC96B2-F447-4B63-B83D-92C3E37CEBF7"><ns1:links><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/persons/D4A75786-5117-4B0E-BB69-5A12940C4D51" ns1:rel="PM_PER"/><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/organisations/FBAA0DD3-4241-474F-BE22-A56FCE34F57B" ns1:rel="LEAD_ORG"/><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/organisations/9DE968FB-9212-43EA-BCA9-C7F39E81D9F3" ns1:rel="PARTICIPANT_ORG"/><ns1:link ns1:href="http://gtr.ukri.org/gtr/api/organisations/FBAA0DD3-4241-474F-BE22-A56FCE34F57B" ns1:rel="PARTICIPANT_ORG"/><ns1:link ns1:end="2015-05-30T23:00:00Z" ns1:href="http://gtr.ukri.org/gtr/api/funds/F0845763-8B8C-46D4-BC4B-0D1CCDD4114A" ns1:rel="FUND" ns1:start="2014-09-30T23:00:00Z"/></ns1:links><ns2:identifiers><ns2:identifier ns2:type="RCUK">131740</ns2:identifier></ns2:identifiers><ns2:title>FLEXIDISC (FLEXIble DISplays Circuitry)</ns2:title><ns2:status>Closed</ns2:status><ns2:grantCategory>Feasibility Studies</ns2:grantCategory><ns2:leadFunder>Innovate UK</ns2:leadFunder><ns2:abstractText>The aim of this project is to exploit recent advances in printed electronics components and demonstrate the feasibility of integrating flexible driver circuitry with a flexible display on plastic. This project addresses three key technical innovations: printed logic circuitry to drive display modules (reducing interconnect complexity), flex-to-flex interconnections to enable robust hybrid systems integration and development of low-voltage plastic displays (&amp;lt;5V). The project outcomes will initially address the toys&amp;amp;games and consumer packaging sectors, with long-term opportunites for wearable electronics, healthcare, automotive and defence/military. The project also supports development of components/systems suitable for wireless sensor networks (WSN) and the Internet-of-Things (IoT).</ns2:abstractText></ns2:project>