10004722Scale-up path for high performance vapour chambersClosedCollaborative R&DInnovate UKThe performance of modern electronic devices such as smartphones, gaming consoles, laptops, desktops, data centre servers, 5G station networks and battery electric vehicles is limited by how fast they can extract and dissipate waste heat generated during operation. Myriofoam's metal foam wicks can double the heat transfer capacity of flat heat pipes and vapour chambers, used in the cooling of modern electronic devices, without increasing their size or thermal resistance, enabling electronic devices to be faster, smaller, lighter and more reliable. The foams can be deposited on a wide variety of pre-formed components in a low-energy, scalable electrochemical process, thereby avoiding the manufacturing challenges of competing metal wick and foam technologies. This project will resolve three critical areas of uncertainty around the process control, application and scale-up path for this technology, enabling the company to secure private investment and co-development projects with industrial partners.