720481Ultra-thiN Integrated Thin-FIlm Electronics Devices (UNITED)ClosedGRD Development of PrototypeInnovate UKPrinted electronics (PE) built on plastic and other cheap substrates (paper/card) can enable new products in high volume markets such as consumer packaging and anti-counterfeit labels. The printed electronics market is estimated to be £1.5B today, growing to £30B by 2021 and £200B by 2027 (IDTechEx), addressing areas such as electronic smart packaging devices which is projected to grow from £0.02B (2012) to £1B (2022, 35B units). PPL has developed printed logic (circuits built from active devices such as transistors and diodes) corresponding to the printed equivalent of a silicon chip for broad applicability in consumer packaging, security (identification and brand protection) and novelty applications. Conventional electronics on PCBs is rigid, difficult to distribute within products and over-engineered, resulting in high cost for these applications. Replacing the PCB with flexible (printed) electronics could overcome these constraints and enable many new ultrathin form-factor products. However, novel highly-automated manufacturing processes are required to meet the extremely high-volumes of these applications and integrate the components. To date existing integration solutions such as pick-and-place, already widely used in PCB electronics, have been adapted to printed electronics. However these processes do not currently cost-effectively scale to the very-high volumes required by consumer packaging and security products (ultimately >1trn units pa). This development-of-prototype project builds on a previous proofof- concept project which investigated transfer of printed logic from its original substrate onto a target surface. This transfer approach substantially broadens the range of applications which can be addressed by PPL’s printed logic and other printed electronics components, in addition to providing lower-cost and improved form-factor for already addressable applications.