10078154Low Cost and SWAP High Density Packaging for Future RADARClosedCollaborative R&DInnovate UKThis project will develop a specialist, plastic encapsulation capability for compound semiconductor devices including high density System in Package (SiP) designs. This production and prototyping facility would be unique, focused on low-weight, low-cost high-density packaging for high power devices for the most challenging materials and operational environments. Some key areas to address include die attach for optimal thermal/mechanical performance and custom design to mitigate issues such as wire bond lift, mould bleed and package delamination. Reducing Size Weight Power and Cost (SWAP-C), while simultaneously increasing complexity is a key enabler for future sensor and detector systems, this project will initially target transmit receive modules for electronically scanned airborne radar systems, but the technology is equally applicable to other detector, sensor and communication systems for defence and commercial applications. Filtronic are designers and manufacturers of components and sub-systems from RF to mmWave based in the North of England. We serve markets including Telecommunications, Critical Communications, Aerospace/Defence and Space. We are a preferred supplier to UK and European defence primes. The state-of-the-art facility would be complementary to our existing manufacturing facilities and would give the UK aerospace and defence industry a significant competitive advantage with a sovereign capability for products that require a high level of security.