10149511PAQNet - Packaging Advancements for Quantum NetworksClosedCollaborative R&DInnovate UKThis project aims to enhance the field of quantum photonic integrated circuits (QPICs) by developing a comprehensive, plug-and-play packaging solution. The project isa collaborative effort between Alter Technology, Wave Photonics, KETS quantum security, Senko Advanced Components, the University of Bristol and the University of Sheffield. The team will create a new service that guarantees low-loss, high-density, and repeatable packaging of quantum PICs and will demonstrate the utility of this by showing packaged demonstration devices for QKD and entanglement distribution systems. This approach will include specialized components, template files for design compatibility and process improvements for low-loss coupling.