10172533Laser-processed Advanced Semiconductors for Environmentally Resilient FLEXible Devices (LASER-FLEX)ClosedFast Start ResponseInnovate UKThe Laser-Flex project aims to revolutionize the manufacturing of flexible semiconductor devices by developing a sustainable, low-cost, and scalable digital process. By combining particle-free (PF) copper (Cu) and zinc oxide (ZnO) inks with advanced laser processing, Laser-Flex will enable high-performance flexible electronics to be fabricated in a single, energy-efficient step. Flexible electronics are at the heart of many emerging technologies, including wearable health monitors, bendable displays, smart packaging, soft robotics, and the Internet of Things (IoT).However, current production methods often rely on expensive and environmentally harmful materials such as silver (Ag), and require energy-intensive processes that use high temperatures incompatible with flexible polymer substrates used in wearables and disposable devices. Additionally, conventional semiconductor layers for FPE are typically deposited using vacuum-based or photolithographic techniques, which are costly, material-wasteful, and unsuitable for large-area or roll-to-roll manufacturing. Laser-Flex addresses these challenges with two key innovations: * **Particle-Free Copper Ink:** By replacing costly silver with copper, a material that is over 99% cheaper and more abundant, and using particle-free formulations, Laser-Flex enables low-temperature (<150 °C) laser sintering of conductive tracks directly onto flexible substrates. This process eliminates the need for ovens and hazardous chemicals, reducing costs and environmental impact. * **Particle-Free ZnO Semiconductor Ink:** Zinc oxide is a stable, non-toxic semiconductor with excellent electronic properties. The project will develop PF ZnO inks that can be precisely patterned using laser energy to form active components like thin-film transistors (TFTs). This enables the creation of flexible logic and sensor circuits through a simplified, single-step manufacturing process. The interdisciplinary Laser-Flex team combines expertise in materials chemistry, laser technology, and flexible electronics to demonstrate fully functional semiconductor components manufactured digitally with minimal energy use and waste. By cutting energy consumption by up to 90%, reducing material waste, and minimising reliance on scarce materials, Laser-Flex supports the UK's ambitions for net-zero innovation and semiconductor sovereignty. It also strengthens the UK's position in the rapidly expanding global flexible electronics market, projected to reach $61 billion by 2030\. Laser-Flex's outcomes will benefit UK manufacturers across electronics, healthcare, automotive, and energy sectors, providing scalable, cost-effective, and environmentally responsible manufacturing technologies essential for the future of flexible electronics.