710305TOFFEE - Transfer OF FlexiblE ElectronicsClosedGRD Proof of ConceptInnovate UKPrinted/thin-film electronics built on plastic and other cheap substrates (paper/card) can enable new products in high volume markets such as consumer packaging and anti-counterfeit labels. The printed electronics market is estimated to be £1.5B today, growing to £30B by 2021 and £200B by 2027 (IDTechEx). PragmatIC has developed printed logic (circuits built from active devices such as transistors and diodes) corresponding to the printed equivalent of a silicon chip for broad applicability in consumer packaging, security (identification and brand protection) and novelty applications. Conventional electronics on PCBs is rigid, difficult to distribute within products and over-engineered, resulting in high cost for these applications. In conjunction with other thin-film components (displays, printed batteries) printed logic can overcome these constraints and enable many new ultrathin form-factor products. Integration methods to connect these thin-film components which provide power, display/lighting, logic and circuitry are required to provide functional products to end-users. To date existing integration solutions such as pick-and-place, already widely used in electronics, have been adapted to printed electronics. This proof-of-concept project will explore alternative integration techniques widely used within the printing community, for thermal transfer of printed logic from its original substrate onto a target surface. This will broaden the range of applications which can be addressed by PPL’s printed logic and other printed electronics components, in addition to providing lower-cost and improved form-factor for already addressable applications.