10028103PRIME-3DClosedCollaborative R&DISCFPrinted electronics can be an enabling technology for lightweight, functional components in many applications including automotive, aerospace and consumer electronics. Although processes for forming 3D printed circuitry are available the technology has limitations on usable substrate materials. Alternative, material agnostic, processes are possible but require development for commercialisation. PRIME-3D will develop the equipment and processes required to build 3D printed components with integrated electronics using a combination of a spray-coated precursor which is subsequently, selectively, activated by laser into a seed layer for electroless plating. The thick conductors formed by plating are suitable for high frequency antenna required in the latest generation mobile phones, demonstrator phone antenna will be manufactured as part of the project.