THE MANUFACTURE OF TEST PROBES USING NANOFABRICATION TECHNIQUES
Lead Research Organisation:
University of Glasgow
Department Name: School of Physics and Astronomy
Abstract
THE MANUFACTURE OF TEST PROBES USING NANOFABRICATION TECHNIQUES
The project is between the particle physics group of the SUPA School of Physics and Astronomy of Glasgow University and the company Probe Test Solutions Ltd, PTSL.
Modern semiconductor technologies rely on miniature semiconductor components. To allow the fabricator of these components to test their devices fine pitch probe needles are required to make electrical contact to them. However, the continued technological development of the semiconductor industry has reduced the device size to the point where the probe needle industry is limited in its ability to probe the device due to minimum probe needle pitch. This project aims at overcoming the technological limitations with the present probe needle pitch with the use of the very nano-semiconductor processing technologies that they are required to probe.
PTSL are a supplier of test hardware solutions to semiconductor customers, concentrating on probe-cards for semiconductor wafer probe. They are based in Lanarkshire, Scotland. The company is a self-financed company, funding its growth purely from revenue generated. A significant portion of their profits is reinvested to improve their offering via new recruits, new equipment, and R&D. The company received the 2012 Lanarkshire business excellence award.
The particle physics group at the university of Glasgow has a strong detector development team. They has successfully designed and built silicon particle tracker systems for leading particle physics experiments. The Glasgow Laboratory for Advanced Detector Development (GLADD) is their new fabrication and test facility. The GLADD, with an estimated worth of £1M in equipment and 17 staff, is a recent step-change for GU-PPE detector development activities. Most recently they competed work for the silicon tracker of the ATLAS experiment and the silicon vertex locator of the LHCb experiment both based at the CERN large hadron collider. They are presently developing the next generation of particle detectors. As part of this work detailed thermal and mechanical models of composite detector and electronic structures were developed. The group has also developed extensive skills in nanofabrication in the University of Glasgow James Watt Nanofabrication Centre, JWNC, arising for the development of novel semiconductor detectors, including the 3D detector. This work was further extended into the area of probes for biological applications. This expertise, gained from STFC funded developments of particle physics instrumentation, will be applied to this project.
The project aim is to investigate the possibility to manufacture small size wafer probe needles using semiconductor nanofabrication techniques for the use to test semiconductor structures.
The project work is divided into four sections. The first is the modeling, using finite element analysis, the proposed probe needles and their fixations. The second work package is the design of a process flow and the development of the process to allow for the fabrication of these needles. The third task is the testing of individual probes and assembled probe heads in the laboratory and production facility of PTSL. Finally validation will take place at a world leading semiconductor component manufacture.
The project is between the particle physics group of the SUPA School of Physics and Astronomy of Glasgow University and the company Probe Test Solutions Ltd, PTSL.
Modern semiconductor technologies rely on miniature semiconductor components. To allow the fabricator of these components to test their devices fine pitch probe needles are required to make electrical contact to them. However, the continued technological development of the semiconductor industry has reduced the device size to the point where the probe needle industry is limited in its ability to probe the device due to minimum probe needle pitch. This project aims at overcoming the technological limitations with the present probe needle pitch with the use of the very nano-semiconductor processing technologies that they are required to probe.
PTSL are a supplier of test hardware solutions to semiconductor customers, concentrating on probe-cards for semiconductor wafer probe. They are based in Lanarkshire, Scotland. The company is a self-financed company, funding its growth purely from revenue generated. A significant portion of their profits is reinvested to improve their offering via new recruits, new equipment, and R&D. The company received the 2012 Lanarkshire business excellence award.
The particle physics group at the university of Glasgow has a strong detector development team. They has successfully designed and built silicon particle tracker systems for leading particle physics experiments. The Glasgow Laboratory for Advanced Detector Development (GLADD) is their new fabrication and test facility. The GLADD, with an estimated worth of £1M in equipment and 17 staff, is a recent step-change for GU-PPE detector development activities. Most recently they competed work for the silicon tracker of the ATLAS experiment and the silicon vertex locator of the LHCb experiment both based at the CERN large hadron collider. They are presently developing the next generation of particle detectors. As part of this work detailed thermal and mechanical models of composite detector and electronic structures were developed. The group has also developed extensive skills in nanofabrication in the University of Glasgow James Watt Nanofabrication Centre, JWNC, arising for the development of novel semiconductor detectors, including the 3D detector. This work was further extended into the area of probes for biological applications. This expertise, gained from STFC funded developments of particle physics instrumentation, will be applied to this project.
The project aim is to investigate the possibility to manufacture small size wafer probe needles using semiconductor nanofabrication techniques for the use to test semiconductor structures.
The project work is divided into four sections. The first is the modeling, using finite element analysis, the proposed probe needles and their fixations. The second work package is the design of a process flow and the development of the process to allow for the fabrication of these needles. The third task is the testing of individual probes and assembled probe heads in the laboratory and production facility of PTSL. Finally validation will take place at a world leading semiconductor component manufacture.
People |
ORCID iD |
Richard Bates (Principal Investigator) |
Description | MEMS probe needles, Improved CVD W and WRe deposition High frequency transmission in probe needles. |
Exploitation Route | We have spun-out a company from the university to commercialise the technology We are now trading. We have secured funding to enable us to trade. We are working with Scottish Enterprise and have received a convertible loan to allow the company to trade. |
Sectors | Aerospace, Defence and Marine,Digital/Communication/Information Technologies (including Software),Electronics,Manufacturing, including Industrial Biotechology |
URL | https://tauprobes.com/ |
Description | We are developing probes for the semiconductor industry. The impact is in this field. During the development we have developed with industry improved CVD deposition of W and WRe layers. This will be used by the material company for further development. Following this grant we have had four STFC IAA funded programs to develop the technology for probes. The first two concentrated on the CVD deposition of W and W-Re working with the UK company ATL. This work has allowed the company to develop for the first time a CVD W-Re alloy. The IAA grants have also developed the ability of the company to perform more uniform CVD deposition and handle silicon wafers without deposition on the backside. The third STFC IAA looked at developing another cheaper and more performant process to replace the CVD W layers. This has been successful and is now the basis of the technology. the final STFC IAA allowed us to develop FEA modelling capability of the probes. We have applied for Innovate UK grants to commercialise the probes that we have developed. We were successful in obtaining an Innovate UK ICURe funded position to perform market analysis. We have also obtained Scottish Enterprise (SE) High Growth Spin-out Project Funding, phase 2 to perform detailed market analysis. The goal of the work is to form a spin-out company which is now registered. We have obtained a convertible loan from Scottish Enterprise which has allowed the company to start to trade. We have submitted a patent and it has been published. |
First Year Of Impact | 2017 |
Sector | Aerospace, Defence and Marine,Digital/Communication/Information Technologies (including Software),Electronics,Manufacturing, including Industrial Biotechology |
Impact Types | Economic |
Description | EARLY STAGE COVID PRE-SEED GRANT HIGH GROWTH SPIN-OUT PROGRAMME |
Amount | £65,600 (GBP) |
Funding ID | SE-202101323 |
Organisation | Scottish Enterprise |
Sector | Public |
Country | United Kingdom |
Start | 10/2020 |
End | 03/2021 |
Description | Impact Acceleration Account - CMP of CVD W wafers |
Amount | £17,325 (GBP) |
Organisation | Science and Technologies Facilities Council (STFC) |
Sector | Public |
Country | United Kingdom |
Start | 10/2018 |
End | 02/2019 |
Description | Impact Acceleration Account - Finite analysis modelling of tungsten semiconductor probe needles manufactured with a MEMS process |
Amount | £19,963 (GBP) |
Organisation | Science and Technologies Facilities Council (STFC) |
Sector | Public |
Country | United Kingdom |
Start | 07/2021 |
End | 12/2021 |
Description | Impact Acceleration Account - Semiconductor probe needle development |
Amount | £29,816 (GBP) |
Organisation | Science and Technologies Facilities Council (STFC) |
Sector | Public |
Country | United Kingdom |
Start | 02/2020 |
End | 11/2020 |
Description | NanoProbe - disrupting the semiconductor test probe market |
Amount | £121,332 (GBP) |
Organisation | Scottish Enterprise |
Sector | Public |
Country | United Kingdom |
Start | 08/2019 |
End | 09/2020 |
Description | NanoProbe - disrupting the semiconductor test probe market - Covid-19 Extension |
Amount | £65,600 (GBP) |
Organisation | Scottish Enterprise |
Sector | Public |
Country | United Kingdom |
Start | 10/2020 |
End | 03/2021 |
Description | NxNW: Innovation to Commercialisation of University Research ([CURe) Programme |
Amount | £78,942 (GBP) |
Organisation | Innovate UK |
Sector | Public |
Country | United Kingdom |
Start | 08/2018 |
End | 01/2019 |
Description | Resource efficiency for materials and manufacturing (REforMM) |
Amount | £81,000 (GBP) |
Funding ID | 10064110 |
Organisation | Innovate UK |
Sector | Public |
Country | United Kingdom |
Start | 05/2023 |
End | 10/2023 |
Description | STFC Impact Acceleration Account |
Amount | £30,000 (GBP) |
Organisation | Science and Technologies Facilities Council (STFC) |
Sector | Public |
Country | United Kingdom |
Start | 01/2017 |
End | 03/2017 |
Description | Industrial collaboration on the development of probe needles |
Organisation | PETA Solutions |
Country | United Kingdom |
Sector | Private |
PI Contribution | We are in the process of developing probe needles for the semiconductor wafer test market. The company makes these and markets them. We are preforming a development of needles that they will eventually manufacture. |
Collaborator Contribution | They have given us guidance and supplied technical know-how. |
Impact | Still at an early stage. Small, fine-pitch probe needles. |
Start Year | 2014 |
Description | Probe testing |
Organisation | NIDEC CORPORATION |
Department | Nidec SV Probe Pte Ltd |
Country | Singapore |
Sector | Private |
PI Contribution | We are working on the development of probe needles |
Collaborator Contribution | probe design and test |
Impact | probe designs and test data |
Start Year | 2021 |
Description | development of CVD tungsten films on silicon wafers |
Organisation | ARCHER |
Country | United Kingdom |
Sector | Charity/Non Profit |
PI Contribution | We are in the process of developing CVD tungsten films on silicon wafers. We have push the development and tested the films electrically and mechanically. We are extending the film development to include W-Re CVD layers. |
Collaborator Contribution | They are performing the CVD runs. they have updated their CVD processing equipment to allow them to process the W films in a more reliable fashion. They are in the process of updating their reactor to allow W-Re deposition. |
Impact | We have made better films. We have started to further this development to look at WRe films. |
Start Year | 2014 |
Title | MICROMACHINED MECHANICAL PART AND METHODS OF FABRICATION THEREOF |
Description | The present invention relates primarily to a method of fabrication of one or more free-standing micromachined parts. The method includes performing reactive ion etching of photoresist and tungsten-based layers supported on a carrier substrate to thereby define one or more micromachined parts, followed by separating the resulting one or more micromachined parts from the carrier substrate such that the parts are free-standing. The invention also relates to tungsten-based microprobe obtainable by such a method, wherein the microprobe has a substantially square or rectangular cross-section in a direction perpendicular to a longitudinal axis of the microprobe, and to probe cards comprising a plurality of such microprobes. |
IP Reference | WO2022008436 |
Protection | Patent application published |
Year Protection Granted | 2022 |
Licensed | Yes |
Impact | Gu has formed a spin-out company and the IP has been licenced to them. |
Title | Semiconductor probe needle |
Description | New manufacturing process for a semiconductor test probe needle resulting in a superior product |
Type Of Technology | New/Improved Technique/Technology |
Year Produced | 2018 |
Impact | We are in the process of spinning out a company. The company will take the product to market to improve semiconductor wafer test |
Company Name | TAUPROBES LTD |
Description | Design and manufacture of semiconductor test probes |
Year Established | 2021 |
Impact | We have a new probe manufacturing technology |
Website | http://www.tauprobe.com/ |
Description | School Visits |
Form Of Engagement Activity | A talk or presentation |
Part Of Official Scheme? | No |
Geographic Reach | Local |
Primary Audience | Schools |
Results and Impact | Various school visits to give talks and demonstrations of pixel detectors. |
Year(s) Of Engagement Activity | 2011,2012,2013,2014,2015 |