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Backside illuminated SPAD image sensor with 7.83µm pitch in 3D-stacked CMOS technology (2016)

First Author: Al Abbas T

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/iedm.2016.7838372

Publication URI: http://dx.doi.org/10.1109/iedm.2016.7838372

Type: Conference/Paper/Proceeding/Abstract