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Investigation of a parasitic-inductance reduction technique for through-hole packaged power devices (2018)

First Author: Dymond H

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/ecce.2018.8558152

Publication URI: http://dx.doi.org/10.1109/ecce.2018.8558152

Type: Conference/Paper/Proceeding/Abstract