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Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer (2022)

First Author: Jiang H

Attributed to: Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2022.114681

Publication URI: http://dx.doi.org/10.1016/j.microrel.2022.114681

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability