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A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography (2014)

First Author: Agyakwa P.A.
Attributed to:  Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Publication URI: https://api.elsevier.com/content/abstract/scopus_id/85084023656

Type: Other

Parent Publication: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems, Proceedings