Investigation of Electrical-Thermal-Mechanical Effects in Electric-Assisted Silver Sintering Process Through Phase Field Modeling (2023)
Attributed to:
Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2023.3327375
Publication URI: http://dx.doi.org/10.1109/tcpmt.2023.3327375
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology
Issue: 11