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Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate (2012)

First Author: Li J

Attributed to: Technologies for SiC electronics and sensors in extreme environments funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jallcom.2012.08.023

Publication URI: http://dx.doi.org/10.1016/j.jallcom.2012.08.023

Type: Journal Article/Review

Parent Publication: Journal of Alloys and Compounds