📣 Try out the NEW Gateway to Research and let us know what you think.

We're looking for users to test the new service during August and September and share their feedback. Express your interest by completing this short form.

Experimental Investigation on the Effects of Narrow Junction Temperature Cycles on Die-Attach Solder Layer in an IGBT Module (2017)

First Author: Lai W

Attributed to: Underpinning Power Electronics 2012: Components Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tpel.2016.2546944

Publication URI: http://dx.doi.org/10.1109/tpel.2016.2546944

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Power Electronics

Issue: 2