Low Stress Cycle Effect in IGBT Power Module Die-Attach Lifetime Modeling (2016)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tpel.2015.2501540

Publication URI: http://dx.doi.org/10.1109/tpel.2015.2501540

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Power Electronics

Issue: 9