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Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device (2017)

First Author: Hu B

Attributed to: Underpinning Power Electronics 2012: Components Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tdmr.2017.2766692

Publication URI: http://dx.doi.org/10.1109/tdmr.2017.2766692

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Device and Materials Reliability

Issue: 4