📣 Try out the NEW Gateway to Research and let us know what you think.

We're looking for users to test the new service during August and September and share their feedback. Express your interest by completing this short form.

Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure (2018)

First Author: Zhang H

Attributed to: Underpinning Power Electronics 2012: Components Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/jestpe.2017.2758901

Publication URI: http://dx.doi.org/10.1109/jestpe.2017.2758901

Type: Journal Article/Review

Parent Publication: IEEE Journal of Emerging and Selected Topics in Power Electronics

Issue: 1