📣 Try out the NEW Gateway to Research and let us know what you think.

We're looking for users to test the new service during August and September and share their feedback. Express your interest by completing this short form.

Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints (2018)

First Author: Li J

Attributed to: Underpinning Power Electronics 2012: Components Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2018.03.013

Publication URI: http://dx.doi.org/10.1016/j.microrel.2018.03.013

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability