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Chip-Scale Coils for Millimeter-Sized Bio-Implants. (2018)

First Author: Feng P

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tbcas.2018.2853670

PubMed Identifier: 30040662

Publication URI: http://europepmc.org/abstract/MED/30040662

Type: Journal Article/Review

Volume: 12

Parent Publication: IEEE transactions on biomedical circuits and systems

Issue: 5

ISSN: 1932-4545