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Study on lifetime prediction considering fatigue accumulative effect for die-attach solder layer in an IGBT module (2018)

First Author: Lai W
Attributed to:  Vehicle Electrical Systems Integration (VESI) funded by UKRI

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1002/tee.22607

Publication URI: http://dx.doi.org/10.1002/tee.22607

Type: Journal Article/Review

Parent Publication: IEEJ Transactions on Electrical and Electronic Engineering

Issue: 4

ISSN: 19314981 19314973