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A Novel Geometric Tolerance Modeling Inspired by Parametric Space Envelope (2018)

First Author: Luo C

Attributed to: Self-Resilient Reconfigurable Assembly Systems with In-process Quality Improvement funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tase.2018.2793920

Publication URI: http://dx.doi.org/10.1109/tase.2018.2793920

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Automation Science and Engineering

Issue: 3

ISSN: 1545-5955