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Hermetic chip-scale packaging using Au:Sn eutectic bonding for implantable devices (2021)

First Author: Szostak K

Attributed to: Empowering Next Generation Implantable Neural Interfaces funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1088/1361-6439/ac12a1

Publication URI: http://dx.doi.org/10.1088/1361-6439/ac12a1

Type: Journal Article/Review

Parent Publication: Journal of Micromechanics and Microengineering

Issue: 9