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3-D Printed Microjet Impingement Cooling for Thermal Management of Ultrahigh-Power GaN Transistors (2021)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2021.3072994

Publication URI: http://dx.doi.org/10.1109/tcpmt.2021.3072994

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology

Issue: 5