📣 Try out the NEW Gateway to Research and let us know what you think.

We're looking for users to test the new service during August and September and share their feedback. Express your interest by completing this short form.

Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite (2022)

First Author: Jiang H

Attributed to: Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.mtcomm.2022.104623

Publication URI: http://dx.doi.org/10.1016/j.mtcomm.2022.104623

Type: Journal Article/Review

Parent Publication: Materials Today Communications