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Modeling Variation in Multi-Station Compliant Assembly Using Parametric Space Envelope (2023)

First Author: Luo C

Attributed to: Self-Resilient Reconfigurable Assembly Systems with In-process Quality Improvement funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1115/1.4062579

Publication URI: http://dx.doi.org/10.1115/1.4062579

Type: Journal Article/Review

Parent Publication: Journal of Manufacturing Science and Engineering

Issue: 9