Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module (2024)
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/access.2023.3342689
Publication URI: http://dx.doi.org/10.1109/access.2023.3342689
Type: Journal Article/Review
Parent Publication: IEEE Access