📣 Try out the NEW Gateway to Research and let us know what you think.

We're looking for users to test the new service during August and September and share their feedback. Express your interest by completing this short form.

Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module (2024)

First Author: Rajaguru P

Attributed to: Closed Loop Digitalised Data Analytics and Analysis Platform (DAAP) for Intelligent Design and Manufacturing of Power Electronic Modules funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/access.2023.3342689

Publication URI: http://dx.doi.org/10.1109/access.2023.3342689

Type: Journal Article/Review

Parent Publication: IEEE Access