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A High-Resolution Open Source Platform for Building Envelope Thermal Performance Assessment Using a Wireless Sensor Network. (2020)

First Author: Lihakanga R

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.3390/s20061755

PubMed Identifier: 32245278

Publication URI: http://europepmc.org/abstract/MED/32245278

Type: Journal Article/Review

Volume: 20

Parent Publication: Sensors (Basel, Switzerland)

Issue: 6

ISSN: 1424-8220