Shear Wave Ultrasound Inspection of Flaws in Silicon Wafers Using Focused Transducers. (2023)
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tuffc.2023.3321254
PubMed Identifier: 37782587
Publication URI: http://europepmc.org/abstract/MED/37782587
Type: Journal Article/Review
Volume: 70
Parent Publication: IEEE transactions on ultrasonics, ferroelectrics, and frequency control
Issue: 11
ISSN: 0885-3010