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Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates (2010)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11664-010-1382-2

Publication URI: http://dx.doi.org/10.1007/s11664-010-1382-2

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 12