Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates (2010)
Attributed to:
Organometallic Synthesis of Reactive Nanoparticles for Radically New Solder Materials
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s11664-010-1382-2
Publication URI: http://dx.doi.org/10.1007/s11664-010-1382-2
Type: Journal Article/Review
Parent Publication: Journal of Electronic Materials
Issue: 12