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Understanding die attach materials performance in electronic packages under harsh environments (2010)

First Author: Sousa M

Attributed to: DURABLE HIGH TEMPERATURE ELECTRONICS PACKAGING FOR DOWN-WELL APPLICATIONS funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/estc.2010.5642948

Publication URI: http://dx.doi.org/10.1109/estc.2010.5642948

Type: Conference/Paper/Proceeding/Abstract

ISBN: 978-1-4244-8553-6