Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additives (2013)
Attributed to:
Organometallic Synthesis of Reactive Nanoparticles for Radically New Solder Materials
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2013.2279055
Publication URI: http://dx.doi.org/10.1109/tcpmt.2013.2279055
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology
Issue: 10