Durable High Temperature Electronics Packaging for Down-Well Applications
Lead Participant:
GE AVIATION SYSTEMS LIMITED
Abstract
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Lead Participant | Project Cost | Grant Offer |
|---|---|---|
| GE AVIATION SYSTEMS LIMITED | £205,229 | £ 80,614 |
Participant |
||
| UNIVERSITY OF OXFORD | £104,830 | |
| GWENT ELECTRONIC MATERIALS LIMITED | £111,493 | £ 43,794 |
| VIBRO-METER U.K. LIMITED | £67,252 | £ 26,423 |
| THERMASTRATE LTD | £54,919 | £ 21,572 |
| SONDEX WIRELINE LIMITED | £50,208 | £ 19,722 |
People |
ORCID iD |