ELCOSINT – Electronic Component Sintered Interconnections

The ELCOSINT project will develop novel polymeric, sintered interconnection materials for electronic assemblies specifically designed to replace high-Pb content materials and further increase the operating temperature of electronic assemblies. The UK has a significant high value manufacturing base in demanding harsh environment applications such as aerospace, down hole drilling, automotive and power management. The multi-disciplinary project team will develop the materials and manufacturing process for electronic component interconnection using nano-silver based materials to form joints between components and substrates. The technology will be compatable with standard microelectronics manufacturing process enabling fast take up. A high temperature sensor amplifier demonstrator will be designed and produced that will allow the characterisation, assessment and qualification of the developments to enable rapid production of reliable, robust electronic systems.