FOAM -Future Optical Amplifier Mounting


The FOAM (Future Optical Amplifier Mounting) project will make the possibility of higher data rates an economic possibility for small rural communities world wide. This is to be achieved by solving some of the fundamental problems associated with the construction of key components within the switching centres and make smaller faster switching centres a reality. At the same time this funding expands the Welsh capabilities in semiconductor packaging and innovation, securing current employment and opening the possibility of increased skilled employment in South Wales.

Lead Participant

Project Cost

Grant Offer

Microchip Technology Caldicot Limited, Bristol £70,765 £ 35,383


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