THEIA - Technically high element aligmenent

The Theia project will investigate the assembly of Infrared Focal Plane arrays using group III-V compound semiconductor devices onto conventional lower cost silicon. The project is novel in that it aims to use conventional commercial specification process and die placement equipment rather than bespoke high tolerance machinery. Typically, these are used in high value applications such as space, military and security. These high resolution imaging systems typically use a combination of Group III-V sensor die stacked onto conventional silicon read-out chip and then placed into a suitable package in a hybrid stack