GANDALF - GAllium Nitride process De-risk for uk Automotive suppLy chains -- a Feasibility study

This is a industrial led project in which the partners assess the feasibility of exploiting the WBG manufacturing capability initiated under an existing DER Fast Start project (105891) to manufacture Nexperia's latest generation of D-mode 650V GaN devices in the UK. This 5 month project will deliver a 200mm process definition (epitaxy and fab), transfer specifications and any relevant technical de-risking. Mutual technical information exchange will be exchanged under NDA on:

* The epitaxial structure of the 650V GaN on silicon HEMT.
* Process flow requirements of Nexperia's proprietary process
* Key performance specifications and qualification requirements

This work is a vital first phase of a longer term ambition to establish a scalable UK capability in GaN materials and chip manufacturing that will also support the future growth ambitions of Nexperia's GaN business. Successful delivery would enable Nexperia's future demand (5000 wafers per month by 2027) to be reshored to the UK (epitaxy and chip fab) from overseas with the additional benefit of being transferred from 150mm to 200mm wafers. The additional phases needed to deliver the full capability are:

* Phase 2: Proof of manufacturing concept including deployment of critical capital equipment
* Phase 3: Capacity ramp to 1kwpm - including capital
* Phase 4: Capacity ramp to 5kwpm -- including capital

It will also significantly expand the scope of project (105891) by both accelerating and de-risking the next stages of delivering a full epitaxy and chip manufacturing capability for 200mm GaN on Si, 650V HEMTs.The complementary capabilities of the three industrial partners provide the UK's most credible route for a cost competitive, 200mm WBG solution that can scale to meet the growing demands of the UK automotive supply chain. Longer-term project benefits include:

* Nexperia can evaluate it's GaN device performance on CSC's epitaxy offering (currently using overseas suppliers) and initiate the process transition from 150mm to 200mm.
* NWF will run Nexperia's test vehicle through their fab and significantly de-risk the subsequent process transfer.
* CSC will validate their 200mm epitaxial wafer products for Nexperia to position them for significant growth in line with Nexperia's forecasts.
* The UK automotive supply chain gains a state of the art WBG front end capability i.e. a one-stop shop in Materials, Process and Packaging. It also secures a high volume business opportunity for UK partners which would otherwise go overseas.

All partners agree this feasibility project is manageable within 5 months and are ready to start by 1st November 2020\.