Purchase of Wire-bonder for support of STFC programme at LSDC
Lead Research Organisation:
University of Liverpool
Department Name: Physics
Abstract
This bid is for £65k to support the purchase of a wire bonder for the LSDC. This matches the funding offered by The University of Liverpool who have recognised the importance of this equipment to the successful delivery of both the ALICE and ATLAS upgrade programmes.
Planned Impact
See the PP CG 2012 and the NP CG submission 2015
| Description | Support of medical instrumentation with PPI |
| First Year Of Impact | 2017 |
| Sector | Healthcare |
| Impact Types | Societal |
| Description | Collaboration with Fondazione Bruno Kessler (FBK) |
| Organisation | Fondazione Bruno Kessler |
| Country | Italy |
| Sector | Private |
| PI Contribution | Creation of the partnership |
| Collaborator Contribution | We have started a partnership in 2 main areas. First with the MicroSystems Division (CMM). Previous staff member Prof. G. Casse became director in 2016. We have expanded this to deep learning with their IT departmetmn |
| Impact | Award of STFC CDT, collabrateion with Microsoft. This multi-disiplinary and impacts health. |
| Start Year | 2017 |
| Description | Support for UK HVCMOS Development |
| Organisation | Lancaster University |
| Country | United Kingdom |
| Sector | Academic/University |
| PI Contribution | Prototype HV-CMOS evaluation boards have been assembled and wirebonded in LSDC using thi wirebonder purchased through this award. |
| Collaborator Contribution | Lancaster and Edinburgh supplied bare PCBs and prototype HV-CMOS sensors. |
| Impact | Assembly of prototype HV-CMOS evaluation boards |
| Start Year | 2020 |
| Description | Support for UK HVCMOS Development |
| Organisation | University of Edinburgh |
| Country | United Kingdom |
| Sector | Academic/University |
| PI Contribution | Prototype HV-CMOS evaluation boards have been assembled and wirebonded in LSDC using thi wirebonder purchased through this award. |
| Collaborator Contribution | Lancaster and Edinburgh supplied bare PCBs and prototype HV-CMOS sensors. |
| Impact | Assembly of prototype HV-CMOS evaluation boards |
| Start Year | 2020 |
| Description | Wirebonding development for Micron Semiconductor Limited |
| Organisation | Micron Semiconductor |
| Country | United Kingdom |
| Sector | Private |
| PI Contribution | Technical staff at Liverpool used the wirebonder purchased as a result of this award to develop the wirebonding programmes for the assembly of a component being developed by Micron Semiconductor Limited. The wirebonding was a challenge due to the geometry of the part and we were able to demonstrate that our wirebonding machine was capable of successfully assembling these prototypes. |
| Collaborator Contribution | Micron Semiconductor supplied prototype parts and a wire bonding jig for us to evaluate. In return we sent them back the completed parts and test certificates for the wirebonding pull strengths. |
| Impact | This work has helped Micron Semiconductor to demonstrate the feasibility of the assembly of their product and has enhanced the scope of deliverables they can offer to their customers. |
| Start Year | 2021 |