ATLAS Upgrade construction proposal

Lead Research Organisation: University of Liverpool
Department Name: Physics

Abstract

Abstracts are not currently available in GtR for all funded research. This is normally because the abstract was not required at the time of proposal submission, but may be because it included sensitive information such as personal details.

Planned Impact

Please see file "Impact statement v2" in lead attachment

Publications

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Argos C (2019) Assembly and electrical tests of the first full-size forward module for the ATLAS ITk Strip detector in Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

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Blue A (2019) Test beam evaluation of silicon strip modules for ATLAS phase-II strip tracker upgrade in Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

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Kiehn M (2019) Performance of CMOS pixel sensor prototypes in ams H35 and aH18 technology for the ATLAS ITk upgrade in Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

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Matheson J (2021) ATLAS ITk pixel endcap demonstrator "Ring-0" construction and testing in Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

 
Description Design of planar pixel detectors for the ATLAS upgrade at the HL-LHC 
Organisation Micron Semiconductor
Country United Kingdom 
Sector Private 
PI Contribution The design of pixel sensors for the High Luminosity upgrade of the ATLAS experiment. Designs of new pixel geometries, implants and guard ring structure for slim and active edge designs.
Collaborator Contribution Signing off the design and input for the design of test structures on the wafers
Impact CERN Pixel wafer designs 1-9
Start Year 2008
 
Description Design of planar pixel detectors for the ATLAS upgrade at the HL-LHC 
Organisation University of Glasgow
Country United Kingdom 
Sector Academic/University 
PI Contribution The design of pixel sensors for the High Luminosity upgrade of the ATLAS experiment. Designs of new pixel geometries, implants and guard ring structure for slim and active edge designs.
Collaborator Contribution Signing off the design and input for the design of test structures on the wafers
Impact CERN Pixel wafer designs 1-9
Start Year 2008
 
Description UK-US power boards for ATLAS upgrade strip barrel modules 
Organisation Brookhaven National Laboratory
Department Physics Department
Country United States 
Sector Public 
PI Contribution Research and development of small form factor powerboard
Collaborator Contribution Development of coils and future asic controller.
Impact This work enables the US to take this ASIC as a deliverable for the ATLAS upgrade project.
Start Year 2016
 
Description UK-US power boards for ATLAS upgrade strip barrel modules 
Organisation Lawrence Berkeley National Laboratory
Department Physics Division
Country United States 
Sector Public 
PI Contribution Research and development of small form factor powerboard
Collaborator Contribution Development of coils and future asic controller.
Impact This work enables the US to take this ASIC as a deliverable for the ATLAS upgrade project.
Start Year 2016
 
Description UK-US power boards for ATLAS upgrade strip barrel modules 
Organisation Penn State University
Department Department of Physics
Country United States 
Sector Academic/University 
PI Contribution Research and development of small form factor powerboard
Collaborator Contribution Development of coils and future asic controller.
Impact This work enables the US to take this ASIC as a deliverable for the ATLAS upgrade project.
Start Year 2016
 
Description UK-US power boards for ATLAS upgrade strip barrel modules 
Organisation Yale University
Department Department of Chemistry
Country United States 
Sector Academic/University 
PI Contribution Research and development of small form factor powerboard
Collaborator Contribution Development of coils and future asic controller.
Impact This work enables the US to take this ASIC as a deliverable for the ATLAS upgrade project.
Start Year 2016
 
Description development of a multiple hybrid panel crate based DAQ system 
Organisation Deutsches Electronen-Synchrotron (DESY)
Country Germany 
Sector Academic/University 
PI Contribution Development of hardware for testing of data transimissions, for data rates upto 640Mbit/s.
Collaborator Contribution Development of firmware for testing and analysis of data transimissions, for data rates upto 640Mbit/s.
Impact Results presented at ATLAS collaboration meetings.
Start Year 2016
 
Description development of a multiple hybrid panel crate based DAQ system 
Organisation Rutherford Appleton Laboratory
Country United Kingdom 
Sector Academic/University 
PI Contribution Development of hardware for testing of data transimissions, for data rates upto 640Mbit/s.
Collaborator Contribution Development of firmware for testing and analysis of data transimissions, for data rates upto 640Mbit/s.
Impact Results presented at ATLAS collaboration meetings.
Start Year 2016
 
Description development of a multiple hybrid panel crate based DAQ system 
Organisation University of Toronto
Department Department of Physics
Country Canada 
Sector Academic/University 
PI Contribution Development of hardware for testing of data transimissions, for data rates upto 640Mbit/s.
Collaborator Contribution Development of firmware for testing and analysis of data transimissions, for data rates upto 640Mbit/s.
Impact Results presented at ATLAS collaboration meetings.
Start Year 2016
 
Description development of assembly tooling and method for strip hybrids 
Organisation Albert Ludwig University of Freiburg
Department Department of Physics
Country Switzerland 
Sector Academic/University 
PI Contribution Development of design of assembly tooling and electrical circuit boards.
Collaborator Contribution Development of design of assembly tooling for alternative method.
Impact Final tools have been designed for the production strip barrel modules. Endcaps will follow the same concept. Tooling design has been shared with the international collaboration.
Start Year 2016
 
Title Automatic visual inspection of ATLAS pixel and strip modules using Machine Learning 
Description Development version of automatic visual inspection of ATLAS pixel and strip modules using computer vision and machine learning to automatically detect defects such as solder splash, missing and misaligned components. This is a critical tool that will be used for the production of at least 6000 pixel modules, and approximately 20,000 strip hybrids. 
Type Of Technology New/Improved Technique/Technology 
Year Produced 2020 
Open Source License? Yes  
Impact Work on the production version of this tool has started, with aim for real-use with the first pre-production modules this year. 
 
Title Design and development of a dosimetry device using ATLAS pixel detectors 
Description Design and build of a device comprising a silicon pixel detector developed for ATLAS IBL submersed in a water tank for accelerator beam QA and dosimetry measurements in hadron therapy. The detector is moved using a precision linear stage allowing spatial and dose profiles of the beam to be made 
Type Of Technology Detection Devices 
Year Produced 2019 
Impact Collaboration with FBK Trento Collaboration with the Rutherford Cancer Centres and Proton Partners International Patent filed 
 
Title Design and submission of RD50-MPW2: a prototype chip with HV-CMOS sensors. 
Description Design and submission of RD50-MPW2. This is a prototype chip with HV-CMOS sensors. The chip size is 3212 um x 2120 um. It is in the 150 nm HV-CMOS process from LFoundry. 
Type Of Technology Detection Devices 
Year Produced 2019 
Impact RD50-MPW2 builds on ongoing research within the CERN-RD50 collaboration to develop depleted CMOS sensors in the 150 nm HV-CMOS process from LFoundry. Laboratory measurements of RD50-MPW1, the first prototype developed by the collaboration, show the leakage current generated by the sensors is large. These results suggest the submission of a second low-cost prototype prior to the planned, large and expensive demonstrator submission (RD50-ENGRUN1) is necessary. RD50-MPW2 integrates several test structures, one small matrix of pixels with analog readout electronics and a Single Event Upset (SEU) tolerant memory array that incorporate several solutions to optimise the leakage current. These solutions have been studied with TCAD simulations prior to the submission of the chip. The foundry has provided support to help better understand their technology process and reviewed the developed solutions. 
 
Description AIDA2020 Topical workshop on Future of Tracking 
Form Of Engagement Activity Participation in an activity, workshop or similar
Part Of Official Scheme? No
Geographic Reach International
Primary Audience Other audiences
Results and Impact Numerous International experts from various aspects of trackers (sensors, mechanics, cooling ...) have been invited to give talks in a Workshop organised by AIDA2020. I am on the organising committee.
Year(s) Of Engagement Activity 2019
URL https://indico.cern.ch/event/781403/registrations/participants