Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging (2012)
Attributed to:
New Dimensions of Engineering Science at Large Facilities
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.tsf.2011.10.211
Publication URI: http://dx.doi.org/10.1016/j.tsf.2011.10.211
Type: Journal Article/Review
Parent Publication: Thin Solid Films
Issue: 6