A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds (2013)

First Author: Li J
Attributed to:  Technologies for SiC electronics and sensors in extreme environments funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.intermet.2013.04.005

Publication URI: http://dx.doi.org/10.1016/j.intermet.2013.04.005

Type: Journal Article/Review

Parent Publication: Intermetallics