Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate (2012)

First Author: Li J
Attributed to:  Power Electronics for Adverse High Temperature Environments (PEATE) funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jallcom.2012.08.023

Publication URI: http://dx.doi.org/10.1016/j.jallcom.2012.08.023

Type: Journal Article/Review

Parent Publication: Journal of Alloys and Compounds