Electroless copper plating using dimethylamine borane as reductant (2012)
Attributed to:
Electroless Deposition: A Mechanistic Approach
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.partic.2011.09.009
Publication URI: http://dx.doi.org/10.1016/j.partic.2011.09.009
Type: Journal Article/Review
Parent Publication: Particuology
Issue: 4