Electroless copper plating using dimethylamine borane as reductant (2012)

First Author: Liao Y
Attributed to:  Electroless Deposition: A Mechanistic Approach funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.partic.2011.09.009

Publication URI: http://dx.doi.org/10.1016/j.partic.2011.09.009

Type: Journal Article/Review

Parent Publication: Particuology

Issue: 4