Adhesion improvement of electroless copper (Cu) thin films deposited on Low Temperature Co-fired Ceramics (LTCC) (2012)

First Author: Rathnayake-Arachchige D
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/estc.2012.6542074

Publication URI: http://dx.doi.org/10.1109/estc.2012.6542074

Type: Conference/Paper/Proceeding/Abstract

ISBN: 978-1-4673-4645-0